3mm Board-to-Board Interconnects

SV Microwave just launched our line of 3mm coaxial between board spacing PCB interconnects. This line allows for the lowest stacked height (3mm) of any board-to-board high frequency coaxial connection system. SV’s 3mm product line is ideal for high density stacked and high density multiport applications. Additionally, installation of this line can be accomplished with and without solder.

Features / Benefits & Applications
Technical Specs
Additional Resources

Features / Benefits:

3mm board-to-board spacing
.150" minimum pitch between adjacent connectors
Direct pogo-pin style connection between PCBs
Lowest stacked height (3mm) of any board-to-board high frequency coaxial connection system
DC - 40 GHz

Applications:

Embedded computing
High density stacked PCB applications
High density multiport applications

3mm

Impedance (Ω)	50
Frequency GHz	40 GHz
Shielding Effectiveness	≥ -80 dB DC - 3 GHz ≥ -65 dB 3 - 26.5 GHz
Dielectric withstanding Voltage	500 VRMS
Mating Cycles	500
Insertion Force - SB	2.8 lbs
Insertion Force - FD	3.4 lbs
Withdrawal Force - SB	2.5 lbs
Withdrawal Force - FD	3.0 lbs
Axial Misalignment	.005"
Radial Misalignment	.007"
Temperature Rating	-65°C to +165°C
Corrosion (salt spray)	MIL-STD-202, Method 101, Condition B
Vibration	MIL-STD-202, Method 204, Condition D
Shock	MIL-STD-202, Method 213, Condition I
Thermal Shock	MIL-STD-202, Method 107, Condition B
Moisture Resistance	MIL-STD-202, Method 106, Less Step 7B
Barometric Pressure (Altitude)	MIL-STD-202, Method 105, Condition C, 70k Ft.